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BGA in Electronics Meaning

The BGA meaning in Electronics terms is "Ball Grid Array". There are 3 related meanings of the BGA Electronics abbreviation.

BGA on Electronics Full Forms

  1. Ball Grid Array A ball grid array is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.
  2. Bump Grid Array
  3. Ball Grid Array [electronic Packaging]

Frequently Asked Questions (FAQ)

  1. What does BGA stand for Electronics?

    BGA stands for Bump Grid Array in Electronics terms.

  2. What is the shortened form of Ball Grid Array [electronic Packaging] in Electronics?

    The short form of "Ball Grid Array [electronic Packaging]" is BGA for Electronics.

Citation

BGA in Electronics. Acronym24.com. (2021, March 1). Retrieved December 23, 2024 from https://acronym24.com/bga-meaning-in-electronics/

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