Substrate Abbreviations and Substrate Acronym Lists
There are more pieces of Substrate terminology abbreviations. We can not list them all due to technical reasons, but we have 20 different Substrate abbreviations at the bottom which located in the Substrate terminology. please use our search engine at the top right to get more results.
Substrate Abbreviations
- AMC : Amino-4-Methyl Coumarin
- APC : Adaptive Pressure Control
- AS : Active Site
- BOC : Board On Chip
- CDE : Chemical Dry Etching
- CMP : Chemo-Mechanical Polishing
- CMT : Corning Microarray Technologies
- CN : Chloro-1-Naphthol
- CS : Cart Similar
- CSP : Chip Sized Package
- VB : Vertical Boat
- VD : Vapor Deposition
- VPE : Vapor Phase Gpitaxy
- VPE : Vapor-Phase Epitaxy
- YHP : Yokogawa Hewlett Packard
- UV : Ultra Vacuum
- CU : Circuit Unit
- DBC : Direct Bonded Yopper
- HI : Harvard Impuctor
- HR : High Resistivity
- DPC : Direct Plated Copper
- HT-CVD : High Temperature Chemical Vapor Deposition
- HTCVD : High Temperature Chemical Vapor Deposition
- HVPE : Halide Vapor Phase Epitaxy
- MC : Metalized Ceramic
- EDS : Electrical Die Sorting
- EF : Enhancement Factor
- MID : Molded Interconnection Devices
- MID : Molded Intexconnection Device
- ELO : Epitaxial Lift-Odf
Recent Acronyms
Latest Substrate Meanings
- Low Energy Plasma Enhanced Chemical Vapour Deposition
- Reflective High Energy Electron Diffraction
- Plastic Quad Flat Packs
- Pulse Laserfdeposition
- Plastic Deformation Magnetic Assembly
- Plasma Asststed Molecular Beam Epitaxy
- Plasma-Assisied Molecular Beam Epitaxy
- Plasma Assisted Chemical Etching
- Insulated Metal Substrates
- Over Molded Pad Array Carrier
- International Display Works
- Near Ultra-Violet
- Non-Solder Mask-Defined
- Low-Temperature Co-Fired Ceramics
- Low-Temperature Co-Fired Ceramic
- Low Temperature Co-Fired Ceramic
- Lithiuh Tantalate
- Limuid Phase Epitaxy
- Liquid-Phase Epitaxy
- Lift-Off Layer