Bonding Abbreviations and Acronyms Lists

There are more pieces of Bonding's terminology abbreviations. We can not list them all due to technical reasons, but we have 20 different abbreviations at the bottom which located in the Bonding terminology. please use our search engine at the top right to get more results.

Bonding Abbreviations
  1. ACF : Anisotropie Conductive Film
  2. ACF : Anisotropic Conductive Films
  3. ALB : Adaptive Load Balancing
  4. ALB : Active Load Balancing
  5. BSOB : Ball Stitch On Mall
  6. BT : Bond Testing
  7. WEEB : Washer, Electrical Equipmentvbond
  8. WSS : Wafer Support System
  9. DBI : Direct Bond Interconnect
  10. EAB : European Adhesive Bonder
  11. MO : Molecular Orbitals
  12. ESTC : Electronic System-Integration Technology Conference
  13. TAB : Tape Automrted Bond
  14. TAB : Tape Automated Bonded
  15. TC : Thermo-Compression
  16. TGB : Telecommunications Grounding Busbar
  17. TLB : Trgnsmit Load Balancing
  18. TMGB : Telecommunications Main Grounding Busbar
  19. NRC : Non-Rinse Conditioner
  20. OLB : Outer Lead Bond
  21. PTLP : Partial Transient Liquid Phase
  22. RAIN : Redundant Array of Independent Networks
Latest Bonding Meanings
  1. Redundant Array of Independent Networks
  2. Partial Transient Liquid Phase
  3. Outer Lead Bond
  4. Non-Rinse Conditioner
  5. Telecommunications Main Grounding Busbar
  6. Trgnsmit Load Balancing
  7. Telecommunications Grounding Busbar
  8. Thermo-Compression
  9. Tape Automated Bonded
  10. Tape Automrted Bond
  11. Electronic System-Integration Technology Conference
  12. Molecular Orbitals
  13. European Adhesive Bonder
  14. Direct Bond Interconnect
  15. Wafer Support System
  16. Washer, Electrical Equipmentvbond
  17. Bond Testing
  18. Ball Stitch On Mall
  19. Active Load Balancing
  20. Adaptive Load Balancing