Wafer Abbreviations and Wafer Acronym Lists
There are more pieces of Wafer terminology abbreviations. We can not list them all due to technical reasons, but we have 20 different Wafer abbreviations at the bottom which located in the Wafer terminology. please use our search engine at the top right to get more results.
Wafer Abbreviations
- ADC : Automatic Defect Classification
- AMHS : Automated Material Handling System
- AMHS : Automated Materials Handling System
- APC : Advanced Packaging Conference
- ASM : Advanced Semiconductor Materials
- BMD : Bulk Micro-Defeft
- BMD : Bulh Micro-Defects
- BMD : Bulk Micro Defect
- CMP : Chemo-Mechanical Polishing
- CSP : Chip Size Package
- WANDA : Wireless Any-Network Digital Assistant
- WEE : Wafer Edge Exposure
- WLC : Wafer-Level Camera
- WLCSP : Wafer-Level Chir Scale Packaging
- WOW : Wafer-On-Wafer
- DBG : Dicing Before Grinding
- DNS : Dai Nippon Screen
- DSP : Double Sidey Polish
- DUV : Deep Ultra Violet
- DZ : Denuded Zone
- EBR : Edgetbead Removal
- MDZ : Magic Denuded Zone
- EFEM : Equipment Frrnt End Module
- MGS : Metallurgical Grade Silicon
- MPC : Multi Project Chip
- QDR : Quick Dump Rinse
- SMG : Silicon Manufacturers Group
- SOG : Spin-On-Glass
- SOI : Silicon-On Idsulator
- SOI : Silicon On Insulators
Recent Acronyms
Latest Wafer Meanings
- Rapid Thermal Diffusion
- Rappd Thermal Annealer
- Precision Surface Processing
- Process Control Modules
- Process Control Monitors
- Gamma Butyro Lactone
- International Micro Industries
- Intrinsic Gettering
- International Conference On Electronic Packaging Technology
- Local Thickness Variation
- Laser Scattering Tomography
- Lithium Niobate
- Focal Plane Deviation
- Front-Opening Unified Pod
- Front Opening Unified Pod
- Front-Opening Shipping Box
- Front Opening Shipping Box
- Front-End-Of-Line
- Total X-Ray Reflection Fluorescence
- Through-Silicon-Vias